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| 3.8x2.0mm DOME LENS SMD CHIP LED LAMP APED3820EC HIGH EFFICIENCY RED Features lLOW l3.8mmx2.0mm SMT LED,3.2mm THICKNESS. lIDEAL FOR BACKLIGHT AND INDICATOR. lVARIOUS lPACKAGE Description POWER CONSUMPTION. The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. COLORS AND LENS TYPES AVAILABLE. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 1 OF 4 Selection Guide P ar t N o . A P E D 3820E C Dic e HIGH EFFIC IENC Y RED (GaAsP/GaP) L en s Ty p e WATER C LEAR Mi n . 18 Iv (m c d ) @ 20 m A Ty p . 40 V i ew i n g An g le 60 (H) 35 (V) 21/2 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l p e a k D 1/2 C VF IR P ar am et er D ev i c e Peak Wavelength D omi nate Wavelength Hi gh Effi ci ency Red Hi gh Effi ci ency Red Ty p . 627 625 45 15 2.0 Max . Un its nm nm nm pF Tes t C o n d i t i o n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Spectral Li ne Half-wi dth Hi gh Effi ci ency Red C apaci tance Forward Voltage Reverse C urrent Hi gh Effi ci ency Red Hi gh Effi ci ency Red Hi gh Effi ci ency Red 2.5 10 V uA Absolute Maximum Ratings at TA=25C P ar am et er Power di ssi pati on H i g h E f f i c i en c y R ed 105 160 -40C To +85C 5 30 Un its mW mA V mA D C Forward C urrent Reverse Voltage Peak Forward C urrent [1] Operati ng/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 2 OF 4 High Efficiency Red APED3820EC SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 3 OF 4 APED3820EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 4 OF 4 |
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